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Webinars - Electronics
Optimal
Thermal Cooling in Electronic System Design
Date and TIme:
November 19, 2009
9:30am PST (California), 12:30 EST (New York),
17:30 GMT (London), 18:30 CET (Paris, Berlin, Madrid)
Increased competition continues to shorten design time and put greater performance and reliability demands on each new generation of products. In the area of thermal cooling and electronic system engineering organizations and thermal analysis groups are feeling the pressure to increase productivity to keep up with the demand.
GUEST SPEAKER: Scott Johnson, Raytheon Space and Airborne Systems
Scott will discuss thermal analysis work at Raytheon and how they are effectively using Computational Fluid Dynamics to address electronic cooling issues.
Existing technology struggles to handle complex geometry, incorporate different physical and environmental scenarios. The addition of engineering simulation tools like Star CCM+ impacts productivity by knocking down these traditional barriers.
The online webinar will demonstrate how engineers can now easily do full system integration using engineering simulation, and incorporate additional capabilities such as aero acoustics and noise reduction, condensation and water intrusion, lithium-Ion battery thermals, and contaminate resistance.
DEMONSTRATION: The event demonstration will show attendees first hand how to reduce model geometry clean up using surface wrapping. Examples of electronic systems operating in different environmental conditions will also be highlighted.
