Thermal management of electronics is critical for a pilot's control of the aircraft
Aircraft thermal management includes management of thermal behavior at the application level (chip and board level in avionics), system level (avionics bay) and aircraft level (wing de-icing, cabin comfort).
  • Numerical Simulations of High Temperature Jets from the Main Propulsion System and Auxiliary Power Unit Impinging Against a Construction of the Passenger Plane
    Newly designed passenger aircraft should meet safety and reliability requirements in imaginable emergency situations, one of which is the burn-through of a combustion chamber body of the main propulsion system (MPS) and of the auxiliary power unit (APU), both on the ground and in-flight. In accordance with the international safety standards, an emergency case is investigated using STAR-CCM+ and Abaqus in which, due to local disruption of the combustion...
  • Temperature distribution on a gas turbine blade.
  • Avionics cooling with STAR-CCM+® showing the aft avionics bay of a Hunter UAV with air supplied through the aircraft environmental control system.
  • Avionics cooling with STAR-CCM+® showing the aft avionics bay of a Hunter UAV with air supplied through the aircraft environmental control system.

With the growth of modern electronics, the traditional mechanical systems in aircrafts, both commercial and military, are being replaced by their faster, smarter, competitive electrical and electronic systems.

The increasing use of composite materials that exhibit highly sensitive thermal behavior compared to traditional metals, coupled with increased functionality of avionics, has also led to the outburst of electronic systems in aircraft.

The integration of specialized electrical and electronics systems within the ever-shrinking available space inside the aircraft comes with demanding thermal management challenges.

Thermal management at multiple levels is a key design aspect in all areas of aerospace & defense – be it commercial, military, space, rotorcraft or unmanned. CD-adapco products offer integrated, multi-physics capabilities for thermal management analysis in a streamlined process, allowing efficient, accurate analysis of thermal behavior, in addition to flow and stress, in a single environment.

STAR-CCM+, CD-adapco’s multi-purpose solver, offers simulation capabilities in these key areas of thermal management:

  • Avionics cooling
  • Electronics cooling (component, board, system, rack, room levels)
  • Engines/APUs
  • Weapons/payload
  • Cabin comfort
  • De-icing

Key technology capabilities within STAR-CCM+ include convection, conduction, radiation and conjugate heat transfer (CHT). STAR-CCM+ offers accurate simulation models for fluid convection (natural/forced, steady/transient, incompressible/compressible), solid conduction (steady/transient) and radiation (surface to surface, participating medium, solar). The ability to simulate fully-coupled conjugate heat transfer, including simultaneous conduction, convection, radiation and thermal stress, is also available.

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