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印刷电路板(PCB)的散热模拟方法
【会议信息】 时间:2016年3月16日下午3:00-4:00 费用:免费(需事先注册) 语言:中文 注册方法: 希望参加本Webinar的客户,请从本页面的注册窗口进行注册。 【内容介绍】 每一个电子组件都至少要包括一个印刷电路板,它的主要用途是为芯片和连接器提供电路连接。PCB的尺寸从几毫米宽、不足1毫米厚(例如智能手表中的电路板)到几百毫米宽、几毫米厚不等。 印刷电路板包括导电和导热层,通常为铜材质,夹在较厚的不导电介质之间。由于其实际尺寸、存在铜质线路以及靠近主要的散热零部件等原因,PCB往往是电子组件热传输路径中的一个重要部分。 它们传播零部件的热量,提供较大的传热面积,以便将热量散发到周围环境中。因此,在热模拟中,对印制电路板准确建模十分重要。 本次网络研讨会将讨论对电子组件的印刷电路板(PCB)进行热建模的主要方法,包括从解决所有线路的详细模型到具有平均属性的简化几何模型等不同方法。 研讨会将对每一种方法进行描述与演示,还将详细说明每一种方法的优劣。 【主讲人】 英文:Ruben Bons 中文:何安定 博士 英文版Webinar录播详见: Thermal Modeling Approaches for Printed Circuit Boards (PCBs) 【关于Webinar】 Webinar是一种通过网络媒体进行的技术研讨活动,...
We would like to invite you to attend our annual STAR South East Asian Conference Join us for a packed, two-day agenda where we will move beyond simulation and into a new era of Multidisciplinary Design Exploration. CFD can be applied to almost any engineering problem, but its real value comes from the ability to improve a product or design through multiple design iterations, using a stream of simulation-generated engineering data to drive the design process. Ultimately, this results in a higher quality, more robust product that better fulfills customer expectations. Leading industrial...
Our annual STAR Global Conference is a great way of or observing the state of the simulation market, and the extent to which the things that we were talking about as “bleeding edge” at the previous conferences are not only finding leverage, but often becoming “the norm” in industrial usage. I spent nearly the whole SGC locked up in a dark room interviewing our customers for video testimonials. It was an incredibly motivating and inspiring, and frankly exhausting experience. The twenty or so customers that I interviewed confronted me with so much passion about their simulation processes that at times it felt like being at a religious “revival” meeting than an engineering simulation conference. Here is what I learned from SGC16.
CD-adapco, a global provider of multidisciplinary engineering simulation and design exploration software, today announced the availability of STAR-Cast v11.02, the casting simulation add-on for STAR-CCM+®. STAR-Cast features a new High Pressure Die Casting module, providing casting engineers with an accurate and user-friendly tool for designing stronger, lighter and higher quality casted parts.
Rotorcraft/UAV Modeling Using Advanced Simulation Tools
Recent advances in automated mesh generation, the availability of high-fidelity and fully-coupled physics, and increased computational power are necessary and enabling factors for CFD-based design of next generation rotorcraft systems. Accurate estimation of hover and performance parameters early in the design stage of vertical take-off and landing (VTOL) systems results in better component design and an overall reduction in the design iterations. Engineering simulation is well suited for studying complete configurations of VTOL systems such as helicopters, drones and UAVs. In this webcast...
Redução de custos com Simulações de Engenharia para a indústria de Óleo e Gas
O cenário econômico mundial está pressionando as operadoras de óleo e gás e seus fornecedores com fortes cortes de orçamentos mantendo os requisitos para entrega de equipamentos e produção. No Brasil estamos enfrentando uma crise agravada pela instabilidade política e econômica, que eleva a complexidade de tal desafio para as empresas no ramo petrolífero conseguirem alcançar seus objetivos com cada vez menos recursos financeiros disponíveis. É nestes momentos que a Engenharia precisa aprimorar sua atuação para conseguir resolver os desafios apresentados. Simulações numéricas são utilizadas...
Workflow automation and ease of use continue to be a focus of STAR-CCM+ v11.02. Reference geometries such as points, planes, axes and coordinate systems can now be created on a component in 3D-CAD. These entities will remain ‘pinned’ to the geometry they are created from, making it easy to build more complex geometries and enabling automated design exploration.
STAR-CCM+ v11.02 新機能紹介ウェビナー
本 ウェビナー では、2016年2月24日に世界同時リリースのSTAR-CCM+ v11 . 02 の 新 機能 情報について、下記の 機能 を中心にご 紹介 いたします。 最 新 バージョン v11 . 02 では、 v11 のテーマである“Discover Better Designs, Faster!”を踏襲し、主として以下の 機能 追加・ 機能 改良を行っています。 ・3D-CADにおける参照ジオメトリ 3次元CADモデルのための参照ジオメトリ(点、軸、面等)を作成し、そこから様々なエンティティを作成することができます。 ・局所サーフェスリメッシュ サーフェスリメッシュを部分的に行えるようになり、設計変数等で部分的にメッシュ条件が変更された場合のメッシュ再生成コストが節約できます。 ・オイラー混相流のための摩耗浸食モデル ラグランジェ混相流や離散要素法によるモデル化が難しい連続-分散流れ場 にて、混相分離型流れモデルを利用したエロージョン評価が可能です。 ・円筒形状の粒子 離散要素法(DEM)で円筒形状の粒子の取り扱いが可能になります。 ・レオロジー解析における同時押出し 機能 複数の物理連続体を設定し、2種以上の材料を同時に押し出す解析が可能となりました。 ・流体構造連成(FSI)解析での回転体の取り扱い FSI解析時に回転する固体部品をモデル化できます。 ・...

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