Electronics Thermal Management
Course Duration: 2 Days
Who Should Attend
This course is intended for electronics system designers and packaging specialists involved in thermal management and analysis. Prior experience with STAR-CCM+, is strongly recommended, but not required.
Course Description
The purpose of this course is to teach students the methods used to conduct effective thermal analyses of electronics packages using STAR-CCM+. The course is structured as a combination of lectures and workshops (tutorials). The course begins with a discussion of typical electronics package geometries and demonstrates the import, preparation and meshing of these geometries for computational analysis. Students then proceed to conduct STAR-CCM+ analyses of forced-flow and passive air cooling including the combined effects of conduction and thermal radiation. Various options for modeling fan effects are discussed and demonstrated. Electronics thermal reliability is then discussed and typical analyses, including the calculation of thermo-mechanical stresses, are performed. Finally, advanced topics such as heat pipes, phase-change cooling, ram-air cooling and space applications, are discussed, and an optimization study of a heat sink design is performed.
Course Content
- Day 1
- Lecture: Overview and Introduction to Electronics Thermal Management
- Lecture: Geometry Data Import & Surface Wrapping
- Workshop: Data Import & Meshing of an Electronics System
- Lecture: STAR-CCM+ Heat Transfer Capabilities for Electronics Cooling Analysis
- Lecture: Fan Modeling and Air Distribution Systems
- Workshop: Forced Convection Conjugate Heat Transfer Analysis of a Circuit Board
- Day 2
- Lecture: Passive Cooling of Electronics
- Workshop: Analysis of Natural Convection Flow including Thermal Radiation
- Lecture: Overview of Electronics Thermal Reliability Issues
- Workshop: Analysis of Transient Power-Up and Thermal Cycling
- Lecture: Advanced Topics
- Workshop: Geometry Construciton and Parametric Studies using 3D-CAD
| Date | Location | Registration | |
|---|---|---|---|
| Jun 12 - Jun 13 | Los Angeles | Information | |
| Jul 4 - Jul 5 | Nuremberg | Information | |
| Aug 29 - Aug 30 | London | Information |
- 3-Day STAR-CCM+
- Aero-Acoustics
- Applied Computational Combustion Analysis
- Automated Simulation for Vehicle Analysis
- Building Services Analysis
- Computational Analysis of Wind Parks
- Computational Simulation of Fluid-Structure Interactions with STAR-CCM+
- Effective Heat Transfer Modeling
- Electronics Thermal Management
- Engine Compartment Thermal Modeling
- Hydrology and Environmental Hydraulics
- Introduction to CFD
- Introduction to Particle Modeling using the Discrete Element Method
- JAVA™ Scripting - Process Automation
- STAR-CCM+ Extensions
- STAR-CCM+ Online
- STAR-CCM+ Wizard Creation
- Surface Wrapping using STAR-CCM+
- Virtual Tow Tank
- 2 Day STAR-CCM+ Extensions
- 2-Day STAR-CCM+
- 3-Day JAVA™ Scripting - Process Automation
- Advanced STAR-CCM+
- Battery Design Studio® and Battery Simulation Module
- DARS Basics
- es-ice
- GT Power
- Internal Combustion Engine Modeling
- Introduction to CFD for the Naval Architect
- Simulation and Analysis of Casting Processes
- Simulation and Analysis of Investment Casting
- Simulation of Rigid Body Motion for Engineering Analysis
- STAR-CD
- TOSCA Fluid Basic Seminar
- Virtual Thermal Reliability Lab
- Wind Turbine Analysis