Power electronics devices such as IGBTs and MOSFETs are a key enabling technology for the most advanced electrically-driven systems today and in the foreseeable future. These systems are becoming increasingly common in ground transportation, aerospace and marine, but their continued development and usage will be limited by the thermal management technologies used to cool the semiconductor devices. Despite the high efficiency of power electronics, the enormous amounts of electrical power transmitted mean very large heat loads must be managed.
This webcast explores various techniques for thermal modeling of power electronics devices. Key steps in the simulation process as well as the enabling technologies in STAR-CCM+ are covered, including tips and tricks for the most efficient and accurate models. The models used for demonstration and illustration vary from geometrically fully-detailed to a simplified geometry coupled to a network thermal model. The techniques and technologies provide the tools needed by the thermal architect and thermal design engineer to continue to improve the usage of power electronics.